![DBI hybrid bonding](https://host.easylife.tw/pics/202012/DSM7/01_DSM7.png)
DBI®Ultraisanenablinglow-temperature,lowprofiledie-to-waferanddie-to-diehybridbondingtechnologyplatform.Byeliminatingtheneedforcopper.,DBI®isalowtemperaturehybriddirectbondingtechnologythatallowswaferstobebondedwithexceptionallyfinepitch3Delectri...
Low Temperature Hybrid Bonding for Die to Wafer Stacking ...
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由GGao著作·2021·被引用14次—TheXperidietowaferhybridbondingtechnology,DBI®Ultra,isnowreadyforindustryadoptionandramptomanufacturing.Thebondtakesplaceatroom ...
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